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 Intermetallic Scanning electron microscope Hardness Eutectic system Electromigration Ultimate tensile strength Dislocation creep Wetting Restriction of Hazardous Substances Directive Ductility Solder X-ray crystallography Welding Spectroscopy Transmission electron microscopy Infrared spectroscopy Adsorption Phase diagram Solid solution Sandwich compound Cathode Anode Polymer Yield (engineering) Viscoelasticity Finite element method Contact angle Hydrophile Piezoelectricity Dielectric Perovskite Curie temperature Austenite Strain rate
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Intermetallic  18 times
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Eutectic system  5 times
Dislocation creep  5 times
Wetting  3 times
Tin  3 times
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Printed circuit board  2 times
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Nickel  2 times
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Publications tagged with this subject: 50

Note: Top 50 publications shown only. Open an item panel to view more info


1. Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

2. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints

3. Effect of Gold on the Microstructural Evolution and Integrity of a Sintered Silver Joint

4. Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump

5. Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints

6. Low temperature and low pressure bonding of plateless Cu–Cu substrates by Ag-based transient liquid phase sintering

7. Flip-chip assembly: is the bi-material model acceptable?

8. Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

9. Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

10. Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for flip chip technology

11. Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

12. Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress

13. Structural and magnetic properties of the ring shaped 40 wt% Y211 added TSMG Y123 bulk superconductors welded by Ag2O added MPMG YBCO solder material

14. Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing

15. Growth Kinetics of Intermetallic Compounds During Interfacial Reactions Between SnAgCuGa Lead-Free Solder and Cu Substrate

16. Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation

17. A superior interfacial reliability of Fe–Ni UBM during high temperature storage

18. Microstructure and mechanical behavior of Sn–40Bi–xCu alloy

19. Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems

20. Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing

21. Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate

22. Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C

23. Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy

24. Study of intermetallic compounds (IMC) that form between indium-enriched SAC solder alloys and copper substrate

25. A New Thermodynamic Description of the Bi-Pb-Sn System

26. Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

27. Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

28. Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density

29. Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn

30. Influence of Zn additions on the interfacial reaction and microstructure of Sn37Pb/Cu solder joints

31. Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints

32. Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion

33. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

34. Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate

35. Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy

36. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

37. Development and First Assessment of a DIC System for a Micro-Tensile Tester Used for Solder Characterization

38. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials

39. A review of soft errors and the low α-solder bumping process in 3-D packaging technology

40. Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

41. Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature

42. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

43. The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions

44. A numerical model for a hypoeutectic alloy droplet deposition with non-equilibrium solidification

45. Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint

46. Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates

47. The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

48. Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction

49. Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing

50. Optimization of Solder Volume in Printed Circuit Board Assembly Through an Operating Window Experiment—A Case Study


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